摘要：SKiN技術是使用燒結層替代焊接的新技術，通過無綁定線封裝技術平臺增強了可靠性、減小了熱阻、并改進了內部寄生電感。本文介紹了采用該技術設計的功率模塊的性能特點，并進行了樣機測試。 敘詞：SkiN技術，燒結，功率模塊 Abstract：Skin technology is a new one applying sintered layer instead of welding, which enhances reliability, reduces thermal resistance, improves internal parasitic inductance, through no-bond-wire encapsulation technology platform. The article introduces performance and features of the power module applying this technology, and demo test is conducted in the meantime. Keyword：Skin Technology, Sintering, Power Module